2026 Summer - ASIC Package Engineering Intern at Advanced Micro Devices, Inc

, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

31 Mar, 26

Salary

0.0

Posted On

31 Dec, 25

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Transmission Lines, Electric Circuits, Package Design Software, Silicon Design, PCB Design Software, Scripting Languages, Perl, Python, SQL, Semiconductor Theory, Packaging Process, Data Analytics, Data Visualization Tools, PowerBI

Industry

Semiconductor Manufacturing

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. As an AMDintern, you’ll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You’ll do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end-users worldwide. Whether you’re an undergrad or a PhD student, your contributions matter—and your experience here will be a launchpad for what comes next. JOB DETAILS: Location: Hsinchu Onsite/Hybrid: This role requires the student to work full time (40 hours a week), either in a hybrid or onsite work structure throughout the duration of the co-op/intern term. Duration: Jun - Aug 2026 WHAT YOU WILL BE DOING: We are seeking a highly motivated ASIC Package Engineering intern to join our team and work with our team of engineers in bringing new and advanced packaging technology to reality. In this role – We will have your involvement in supporting Package design and Package Development Engineers in prioritizing and optimizing new projects We will train you to complete substrate, interposer and bump designs for AMD products, test vehicles and probe card substrates We will assign you projects related to design verification implementation toensure design performance, quality and efficiency Analyzing yield and defect metrics to ensure design performance and helpimprove the yield will be part of your responsibilities We will encourage you to evaluate, benchmark packaging materials and interact with partners to achieve the most cost-efficient design and materials for the best performance and yield requirements WHO WE ARE LOOKING FOR: You are currently enrolled in a Taiwan based University into a Master program majoring in Electrical engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field If you have knowledge / experience with any of the following technical skills (or related areas) and are enthusiastic about this role, we strongly encourage you to apply – o Course related to transmission lines and electric circuits o Package, silicon or PCB design software o Scripting languages – Perl / Python / SQL o Semiconductor theory and packaging process/technolog. o Data analytics and data visualization tools like powerBI #LI-EJ1 #LI-HYBRID Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Responsibilities

The intern will support Package Design and Package Development Engineers in prioritizing and optimizing new projects. Responsibilities include completing substrate, interposer, and bump designs, analyzing yield and defect metrics, and evaluating packaging materials.