3D IC and ADVANCED PACKAGING CAD ENGINEER at Advanced Micro Devices, Inc

Markham, Ontario, Canada -

Full Time

Start Date

Immediate

Expiry Date

10 Sep, 26

Salary

0.0

Posted On

12 Jun, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

3D-IC Design, Advanced Packaging, CAD Flow Development, Machine Learning, Large Language Models, Python, TCL, Perl, Verilog, RTL, UPF, Synopsys 3DIC Compiler, Cadence Tools, Linux/Unix, Cloud Compute, Digital Design

Industry

Semiconductor Manufacturing

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: The 3D-IC Design and SoC Construction CAD team delivers automated environments for industry-leading 3D stack generation and validation. Our flows encompass design element creation, port assignment and pattern generation, tile optimization, clock and power distribution, high-performance bus implementation, and timing budgeting. We evaluate, procure, and deploy technologies from leading EDA vendors within a unified flow framework — and increasingly, we embed AI-driven capabilities at every stage of the stack, from silicon to system. This role is part of a global team working in concert with design teams across North America, China, and India. You will collaborate directly with the global CAD organization and project teams to understand design requirements and deliver innovative solutions that combine EDA tools, custom in-house capabilities, and end-to-end AI integration. The ideal candidate brings a strong silicon hardware design background, software and scripting proficiency, and hands-on experience applying machine learning to CAD or EDA workflows. THE PERSON: You have a passion for modern, complex processor architecture, digital design, and the automation that makes it scale. You are energized by the intersection of AI and CAD — whether that means applying ML models to improve QoR, building LLM-assisted flows, or designing agentic systems that reduce manual iteration. You are a team player with excellent communication skills, comfortable collaborating across sites and time zones, and eager to take on hard, open-ended problems. KEY RESPONSIBILITIES: Implement and maintain 3D-IC and advanced packaging design flows from RTL through signoff. Develop and integrate end-to-end AI capabilities into CAD flows — including ML-based optimization, predictive modeling, and LLM-assisted automation. Build and deploy agentic AI systems that automate multi-step design and verification tasks. Partner with EDA vendors (Synopsys, Cadence) on 3D-IC feature requirements, best practices, and AI co-development opportunities. Define strategy and key initiatives to ensure flows meet future design requirements and advanced technology nodes. Regress methodology, analyze results, and develop capabilities that measurably improve quality of results. Work closely with design and CAD implementation teams to deliver tools and flows meeting key QoR metrics: Timing, Area, and Performance. PREFERRED EXPERIENCE: Strong experience in 3D-IC design and advanced packaging technologies. Hands-on experience with Synopsys 3DIC Compiler and related EDA toolchains. Strong understanding of EDA tools from Synopsys and Cadence. Demonstrated experience applying AI to CAD, EDA, or hardware design problems. Experience building or working with LLM-based tools, agentic AI frameworks, or AI-assisted automation pipelines. Strong scripting skills in Python, TCL, and Perl in a Linux/Unix environment. Experience with Verilog, RTL, and UPF for multi-clock domain and low power designs. Familiarity with distributed and cloud compute environments for flow automation. Excellent verbal and written communication skills. ACADEMIC CREDENTIALS: Bachelors or Masters degree in computer engineering/Electrical Engineering LOCATION: Markham, ON #LI-SL3 #LI-HYBRID Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.

Responsibilities

Implement and maintain 3D-IC and advanced packaging design flows from RTL through signoff. Integrate AI capabilities, including ML-based optimization and agentic AI systems, to automate design and verification tasks.