Account Technologist (PVD Advanced Packaging) at Applied Materials

Tainan, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

28 Feb, 26

Salary

0.0

Posted On

01 Dec, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Materials Science, Physics, Chemical Engineering, PVD Experience, Advanced Packaging, Hybrid Bonding, Chiplet Integration, SPC, DOE, Metrology, Yield Analytics, Thin-Film Metallurgy, Reliability-Critical Stack Design, Communication Skills, Problem-Solving, Root Cause Analysis

Industry

Semiconductor Manufacturing

Description

Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. What We Offer Location: Guany-in,TWN, Hsinchu,TWN, Hukou,TWN, Kaohsiung,TWN, Linkou,TWN, Singapore,SGP, Taichung,TWN, Tainan,TWN You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. Key Responsibilities Enable Next-Gen Solutions Through Direct Engagement: Act as the technical owner for PVD solutions at assigned OSATs and Fabless accounts, ensuring alignment between design requirements and manufacturing processes. Understand Customers and Fabless stakes holders technical roadmap. Partner with Fabless packaging architects to define material stacks, reliability criteria, and integration flows; translate these into executable solutions for OSATs. Lead joint qualification programs involving Fabless and OSAT stakeholders: define success metrics, DoEs, and acceptance gates; manage execution to schedule. Process Qualification & Ramp: Establish process-of-record (POR) for advanced packaging applications (e.g., RDL barrier/seed, TSV liners, hybrid bonding underlayers). Drive tool acceptance (FAT/SAT) and HVM ramp at OSAT sites: SPC setup, chamber matching, defectivity control, and yield stabilization. Validate PVD film integrity under Fabless-driven reliability tests (JEDEC/IPC standards: EM, TDDB, thermal cycling). Cross-Functional Collaboration: Coordinate with Applied Materials’ Product Engineering, Field Service, and Quality teams to deliver robust solutions tailored to OSAT and Fabless needs. Resolve integration challenges across packaging flows (e.g., ESD, adhesion, contamination, stress) through structured problem-solving. Continuous Improvement: Lead structured root cause analysis on yield/reliability excursions; implement corrective actions and verify effectiveness. Provide feedback to internal engineering for hardware and process enhancements based on OSAT and Fabless requirements. Required Qualifications Bachelor’s or Master’s in Materials Science, Physics, Chemical Engineering, or related field; PhD preferred. 10+ years in semiconductor equipment/process engineering with strong PVD experience in Advanced Packaging (FO-WLP, 2.5D/3D, RDL/UBM). Proven success enabling solutions through direct engagement with OSATs and Fabless design houses. Preferred Qualifications Experience enabling hybrid bonding or chiplet integration through PVD underlayers. Familiarity with APAC OSAT ecosystem and Fabless packaging roadmaps. Proficiency in SPC, DOE, metrology, and yield analytics. Expertise in thin-film metallurgy (Cu, Ni, Ti, Ta/TaN, Co) and reliability-critical stack design. Strong communication skills to engage executive Fabless stakeholders and OSAT engineering teams. Work Location Science Park II (Moving to Tampines in end 2026) Additional Information Time Type: Full time Employee Type: Assignee / Regular Travel: Relocation Eligible: No Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law. We have seen a recent rise in recruitment scams and want to share some info to help you protect yourself during your job search with Applied Materials. Learn More

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Responsibilities

Act as the technical owner for PVD solutions at assigned OSATs and Fabless accounts, ensuring alignment between design requirements and manufacturing processes. Lead joint qualification programs and establish process-of-record for advanced packaging applications.