Start Date
Immediate
Expiry Date
20 Jul, 26
Salary
0.0
Posted On
21 Apr, 26
Experience
5 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Die Attach, Clip Attach, Vacuum Reflow Oven, Equipment Maintenance, Troubleshooting, Design Of Experiments, Statistical Analysis, Semiconductor Assembly, Backend Assembly, Flip Module, Engineering, Material Science, Physics, Communication, Innovative Thinking, Cross-functional Collaboration
Industry
Semiconductor Manufacturing