Advanced Package Design Engineer at SK hynix America

San Jose, California, United States -

Full Time

Start Date

Immediate

Expiry Date

13 May, 26

Salary

155000.0

Posted On

12 Feb, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Advanced Packaging, Interposers, EDA Tools, Layout Design, High-Speed Signal Routing, Power Distribution Networks, 2.5D Packaging, 3D Packaging, Thermal Management, Manufacturing Collaboration, Communication Skills, Cross-Functional Teamwork, Failure Mechanisms, Analytical Techniques, Simulation Tools, Design Rules

Industry

Semiconductor Manufacturing

Description

Job Title: Advanced Package Design Engineer Office Location: San Jose, CA Work Model: Onsite About SK hynix America At SK hynix America, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape. We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We're not just adapting to technological change – we're driving it, with significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of what's possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing. Job Summary: We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solutions. You’ll collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost-effective package solutions Responsibilities: Design silicon and organic interposers for advanced packaging solutions Experience in EDA tools such as Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition to create and verify advanced package layouts Perform design studies and what if scenario analysis for advanced packaging schemes to optimize the overall package design. Create and maintain layout design rules, stack-ups, and layout guidelines Collaborate with internal and external stakeholders to ensure seamless advanced packaging technology development Qualifications: Bachelor’s or Master’s degree in Electrical Engineering (Preferred), Mechanical Engineering, Material Science, or a related field. 3+ years of experience in semiconductor package design or layout Proven experience with layout tools Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition Understanding of high-speed signal routing, power distribution networks (PDN) Familiar with 2.5D/3D packaging technologies, substrate design rules, and large body substrate technologies Effective communication skills and ability to work in a fast-paced, cross-functional environment Preferred Qualifications: Currently pursuing a PhD's degree in Electrical Engineering or a related field 5+ years of experiences in advanced packaging layout design Experience with SI/PI simulation tools (Ansys, HFSS, ADS) Proven understanding of high-speed signal routing, power distribution networks (PDN) Proven technical understanding of advanced packaging materials, their interactions, failure mechanisms and analytical techniques Benefits: Top Tier health insurance at no employee cost Paid day offs: PTO + Company Holidays + Happy Fridays Paid Parental Leave Program 401k Matching Educational reimbursement up to $10,000 per year Donation Matching and volunteering opportunities Corporate discount programs Free Breakfast/Lunch/Dinner provided to employees Equal Employment Opportunity: SKHYA is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws. Compensation: Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process. Pay Range $110,000—$155,000 USD

Responsibilities

The Advanced Package Design Engineer will design and optimize high-performance, high-density interposers for chiplet-based architectures. Collaboration with PCB, SI/PI, thermal, and manufacturing teams is essential to deliver robust and cost-effective package solutions.