Piper Companies is hiring an Advanced Packaging Engineer with a small start up based in Saratoga, CA. The Advanced Packaging Engineer will need to be a multi-disciplinary expert with a deep background in advanced packaging technologies (especially 2.5D CoWoS), and strong system integration expertise. The Advanced Packaging Engineer will need to sit on site in Saratoga, CA 5 days per week.

REQUIREMENTS FOR THE ADVANCED PACKAGING ENGINEER:

• Bachelor’s in Mechanical, Electrical, or Chemical Engineering; Master’s a plus
• 15+ years in advanced IC packaging development, with deep CoWoS expertise
• System-level knowledge of packaging integration (power, signal, thermals)
• Familiar with substrate/interposer technologies, multi-die co-design, and 3D stacking (preferred)
• Experience with test vehicles, fine-pitch interconnects, and material evaluation
• Proven collaboration with TSMC and/or other global foundries
• Strong analytical, organizational, and cross-functional communication skills

• Lead development of test vehicles and packaging flows for multi-die architectures (e.g., CoWoS, bridge-based, MCM)
• Drive integration of packaging into system designs (thermal, electrical, mechanical alignment)
• Collaborate with foundries and OSATs to oversee tooling, materials, and process readiness
• Guide early learning, DFM/DFY/DFR implementation, risk mitigation, and qualification planning
• Support failure analysis and root cause investigations for material and yield issues
• Define integration best practices, material specs, and reliability requirements
• Present status, risks, and strategy updates to leadership and external partners