Advanced Packaging Integration Engineer at Piper Companies
California, California, USA -
Full Time


Start Date

Immediate

Expiry Date

30 Oct, 25

Salary

275000.0

Posted On

30 Jul, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

No

Skills

Ic Packaging, Technology, 3D, Foundries

Industry

Mechanical or Industrial Engineering

Description

Piper Companies is looking for an Advanced Packaging Integration Engineer to join a cutting-edge startup onsite in Saratoga, CA. The ideal Advanced Packaging Integration Engineer will drive the development and integration of next-generation packaging solutions for high-performance semiconductor products.

QUALIFICATIONS FOR THE ADVANCED PACKAGING INTEGRATION ENGINEER:

  • 10+ years of experience in advanced IC packaging, with a strong background in system-level integration.
  • Must be eligible to work in the United States and obtain and maintain an Active U.S. Government Secret Clearance.
  • Knowledge in CoWoS technology
  • Strong experience with 2.5D and 3D stacking and chiplet-based architectures.
  • Proven ability to lead cross-functional teams and manage vendor relationships with foundries and OSATs.
  • Strong understanding of substrate technologies and multi-die co-design.
  • Bachelor’s degree in Mechanical, Electrical Engineering or Materials science background are a plus.
Responsibilities
  • Lead advanced packaging initiatives, including 2.5D CoWoS and chiplet-based integration, from concept through production.
  • Collaborate with global teams to align packaging strategies with system-level requirements.
  • Own the development of test vehicles and qualification plans for multi-die and high-density packaging technologies.
  • Influence system architecture by integrating packaging solutions that optimize thermal, mechanical, and electrical performance.
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