Piper Companies is looking for an Advanced Packaging Integration Engineer to join a cutting-edge startup onsite in Saratoga, CA. The ideal Advanced Packaging Integration Engineer will drive the development and integration of next-generation packaging solutions for high-performance semiconductor products.

QUALIFICATIONS FOR THE ADVANCED PACKAGING INTEGRATION ENGINEER:

• 10+ years of experience in advanced IC packaging, with a strong background in system-level integration.
• Must be eligible to work in the United States and obtain and maintain an Active U.S. Government Secret Clearance.
• Knowledge in CoWoS technology
• Strong experience with 2.5D and 3D stacking and chiplet-based architectures.
• Proven ability to lead cross-functional teams and manage vendor relationships with foundries and OSATs.
• Strong understanding of substrate technologies and multi-die co-design.
• Bachelor’s degree in Mechanical, Electrical Engineering or Materials science background are a plus.

• Lead advanced packaging initiatives, including 2.5D CoWoS and chiplet-based integration, from concept through production.
• Collaborate with global teams to align packaging strategies with system-level requirements.
• Own the development of test vehicles and qualification plans for multi-die and high-density packaging technologies.
• Influence system architecture by integrating packaging solutions that optimize thermal, mechanical, and electrical performance.