Advanced Packaging Process Engineer - Bonding at Micron Technology

Boise, Idaho, United States -

Full Time

Start Date

Immediate

Expiry Date

08 Mar, 26

Salary

0.0

Posted On

08 Dec, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Process Optimization, Yield Improvement, Cost Reduction, Risk Management, Failure Analysis, FMEA, 8D, SPC, FDC, Material Evaluation, Supplier Management, New Product Introduction, Continuous Improvement, Audit Support, Assembly Process, Semiconductor Technology

Industry

Semiconductor Manufacturing

Description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Technology Development (TD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D and manufacturing teams, we ensure the efficient transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Join us to be part of a dynamic and forward-thinking team that is molding the future of technology! Position Overview: As an Advanced Packaging Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives. Responsibilities will include: Identify, diagnose and resolve die and wafer level assembly process related problems Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step Lead / participate in continuous yield improvement and cost reduction activities Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction Support SPC/FDC/RMS/APC Support site to site portability Manage / audit material suppliers to achieve quality, cost and risk management objectives Support internal and external audits Preferred Education: Master's or PhD in Materials Science, Chemistry, Physics or Mechanical Engineering Minimum of 5 years industry experience in Advanced Packaging As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work click here. To learn more about Micron, please visit micron.com/careers For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3) Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Responsibilities

The Advanced Packaging Engineer will develop and optimize processes to enhance product quality and reliability while resolving manufacturing line issues. Responsibilities also include coordinating process evaluations and managing supplier relationships to meet quality and cost objectives.