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ADVANCED PACKAGING TD - Principal Engineer, Process Integration at Micron Technology
Taichung, , Taiwan -
Full Time

Start Date

Immediate

Expiry Date

24 Feb, 26

Salary

0.0

Posted On

26 Nov, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

No

Skills

DRAM Process, HBM Process, DRAM/PKG Test Structure, Reliability Test Flow, Fail Mechanism, PKG Layout Design Rule, JMP, Yield Cube, MobaXterm, Klarity, Klayout, SPC

Industry

Semiconductor Manufacturing

Description
1. DRAM process/structure 2. HBM process/structure 3. 4. 5. DRAM/PKG test structure/program 6. Reliability test flow/condition, fail mechanism. 7. PKG layout design rule 1. JMP 2. Yield cube 3 3. MobaXterm 4. Klarity 5. Klayout 6. SPC
Responsibilities
The role involves working with DRAM and HBM processes and structures. It also includes developing test structures and reliability test flows.