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ADVANCED PACKAGING TD - SR ENGINEER PACKAGE INTEGRATION at Micron Technology
Taichung, , Taiwan -
Full Time

Start Date

Immediate

Expiry Date

11 Feb, 26

Salary

0.0

Posted On

13 Nov, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

No

Skills

HBM Package Structure, Process Flow, Integrated Failure Mode, Process Change Business Process, Project Management, DOE Establishment, Analysis, JMP, XMoba, Yield Cube3, Klayout, SPC

Industry

Semiconductor Manufacturing

Description
1. Comprehensive understanding on HBM package structure and process flow. 2. Familiar with integrated failure mode 3. Familiar with process change business process. 4. Familiar with project managing to meet goal in time. 5. 6. Familiar with DOE establishment and analysis. 1. JMP 2. XMoba 3. Yield cube3 4. Klayout 5. SPC
Responsibilities
The role requires a comprehensive understanding of HBM package structure and process flow. The engineer will manage projects to meet goals in a timely manner.