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ADVANCED PACKAGING TD - SR ENGINEER PROCESS INTEGRATION at Micron Technology
Taichung, , Taiwan -
Full Time

Start Date

Immediate

Expiry Date

24 Feb, 26

Salary

0.0

Posted On

26 Nov, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

No

Skills

HBM Package Structure, Process Flow, Integrated Failure Mode, Process Change Business Process, Project Management, DOE Establishment, Analysis, JMP, XMoba, Yield Cube3, Klayout, SPC

Industry

Semiconductor Manufacturing

Description
Yield and quality improvement for HBM products to support product milestone deliverables. Develop and lead integration processes from the conceptual phase to high-volume production for highly complex package development challenges. Work closely with multiple cross functional teams including defect team, probe testing team, and process module team. Able to work independently along with various projects inside of APTD team. 1. Comprehensive understanding on HBM package structure and process flow. 2. Familiar with integrated failure mode 3. Familiar with process change business process. 4. Familiar with project managing to meet goal in time. 5. 6. Familiar with DOE establishment and analysis. 1. JMP 2. XMoba 3. Yield cube3 4. Klayout 5. SPC
Responsibilities
The role involves yield and quality improvement for HBM products and leading integration processes from conceptual phases to high-volume production. Collaboration with cross-functional teams is essential to address complex package development challenges.