JOB BENEFITS

• 2-way transport provided (Yishun, Woodlands, Jurong East, Sengkang)
• Training & project travel allowance (
• Company canteen & nearby coffee shop

JOB REQUIREMENTS

• Master’s / PhD in Material Science, Physics, Engineering , or related disciplines
• 3–5 years of relevant experience in semiconductor process development (Front-end/Back-end preferred)
• Hands-on experience with DOE tools, semiconductor assembly equipment, and analytical instruments (e.g., SEM/EDX, C-SAM, AFM, confocal microscope, surface profiler, optical microscope); experience with ANSYS/ABACUS for stress & thermal simulation is a plus

• Develop advanced packaging technologies and processes for high-density, high-performance electronic devices
• Collaborate with external customers and partners on technical support and joint development projects
• Work closely with internal R&D and product teams to design and implement new processes
• Utilize DOE methodologies for process optimization and continuous improvement
• Conduct analysis using advanced equipment to identify, evaluate, and resolve failure modes