APTD Equipment Engineer at Micron Technology

Taichung, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

11 Apr, 26

Salary

0.0

Posted On

11 Jan, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Semiconductor Process Engineering, Equipment Engineering, Package Stacking Equipment, Hardware Roadmaps, Cost Optimization, Process Capability Improvement, Root Cause Analysis, Failure Mode Analysis, Design of Experiment Techniques, Statistical Process Control, Defect Analysis, Data Analysis, Problem Solving, Wafer Bonding, Plating, Packaging

Industry

Semiconductor Manufacturing

Description

3+ or more years of semiconductor process or equipment engineering experience, package stacking equipment TC bonder/ Hybrid Bonder. (equipment ex: BESI, ASMPT ) Develop hardware roadmaps for 5+ years in the area of post probe wafer and die processing. cost, availability, and improve hardware and process capability. Optimizing equipment to reduce Collaborating with process development teams to develop innovative new solutions. Conducting root cause and failure mode analysis to understand the limitations of current hardware and drive APTD development projects with OEMs vendors for solutions. Performing fundamental research to drive innovative solutions for next-generation equipment products. Support equipment transfer to production facilities (some domestic or international travel may be required). Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis Strong analytical and creative problem-solving skills. Ability to use extensive technical knowledge to guide strategic directions. Ability to resolve complex issues through root-cause or model-based problem solving. Proficiency in statistics, preferably in statistical process control. Ability to work independently, with minimal direction, and a focus on meeting commitments. Ability to multi-task and manage numerous projects simultaneously. Hands on experience with wafer / assembly tools and overlay systems. M.S./Ph. D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields. 2 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field Experience in equipment development with fundamental understanding of post probe and assembly process and equipment interactions. Experience in wafer bonding, plating, warpage control and packaging process development and understanding of related inline/electrical/probe failure. Knowledge of semiconductor processing, solid-state device physics desirable.

Responsibilities

The APTD Equipment Engineer will develop hardware roadmaps and collaborate with process development teams to create innovative solutions. They will also conduct root cause and failure mode analysis to drive development projects with OEMs and perform research for next-generation equipment products.