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APTD Package Integration Engineer at Micron Technology

Taichung, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

24 Feb, 26

Salary

0.0

Posted On

26 Nov, 25

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Engineering, Statistical Analysis, Python, Excel, C/C++, Unix/Linux, Semiconductor Manufacturing, Problem Solving, Communication, DOE, Electric Yield, Package Reliability, Failure Analysis, Digital Systems, Automation Scripting, Memory Devices

Industry

Semiconductor Manufacturing

Description

Responsible for HBM project (high-bandwidth memory) electric yield calculation for routing review and automation script development. Work with the wafer fab process/ integration group to address process-related defects affecting electric yield Work closely with probe and test related groups. Work closely in conjunction with the APTD process team to set-up experiments using DOE, monitoring progress of changes, and statistical analysis of results Masters or Bachelor's degree in Engineering Strong logical thinking, as applied to general programming and problem solving. English skills and ability to work in a multi-national multi-functional team. Semiconductor manufacturing process (Front-end wafer process / Wafer Probe / Back-end assembly process / Back-end Test Either one, the more the better) Skills and proficiency in statistical analysis/method like JMP/Mini-Tab/Yield3 analytic tools Proficiency in critical computer applications like Excel, Word, Power Point Python or Excel macro familiarity or experience Strong written and verbal communication skills 3 years working experience in semiconductor industry NPI flow and APQP process Semiconductor Wafer/Package Failure Analysis (PFA/EFA) Package Reliability Semiconductor device knowledge Knowledge of fundamental electrical engineering test, as applicable to memory devices and test hardware Knowledge of digital systems and digital logic Basic Unix/Linux terminal C/C++ Python familiarity or experience

Responsibilities

The APTD Package Integration Engineer is responsible for electric yield calculation for HBM projects and automation script development. The role involves collaboration with various teams to address process-related defects and set up experiments using statistical methods.