Assembly Engineering Lead at NXP Semiconductors

Kaohsiung, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

01 Mar, 26

Salary

0.0

Posted On

01 Dec, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Leadership, Communication, Problem Solving, Data Analysis, Data Interpretation, Collaboration, Process Optimization, Risk Assessment, Package Development, Wire Bond Operation, Team Management, Critical Thinking, Ownership, Innovation, Manufacturability, Supplier Management

Industry

Semiconductor Manufacturing

Description

Job Responsibility: Management Team member of NXP Kaohsiung to drive site decision aligning with NXP values and mission. Drive process standardization, best practices, and talent retention & growth for organization sustainability Define, develop and establish process capabilities, strategy and roadmap Develop a strategy to develop new capabilities or to overcome process constraints Collaborate with Innovation NPI/NTI team to enable successful NPI/NTI launch with robust Safe Launch closure Attend and own all BCAM related review on NPI/NTI to ensure risk to process margin/manufacturability is mitigated upfront Constantly on the lookout for new material suppliers / new technology and capability Specifically on risk assessment and process flow optimization, playing the Integrator role of Assembly process from wafer to package finished good Ensure business continuity in process, working with Purchasing to identify critical suppliers and develop 2nd sourcing strategy Maintain a matrix on process capabilities and constraints Work with UG/Equipment counterpart on equipment benchmarking Job Qualification: Bachelor Degree in relevant engineering fields 15 + Years of Experience in Semiconductor industry is mandatory Competent in package development and Wire Bond operation will be added advantage Certification or proven competency in problem solving, 8D, 3x5whys.. Experience in running engineering teams in wire bond, die bond, or mold Strong leadership skills with good communication Excellent in logic thinking for data analysis and data interpretation skills Excellent in critical data-driven decisions Hands on, strong ownership, and able to collaborate as team player Key Competencies most required include: Drives Results Problem Solving Manages Ambiguity Collaborates More information about NXP in Greater China... #LI-6a60 NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer, and more sustainable world through innovation. As the world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. For more information, visit www.nxp.com Bright Minds. Bright Futures. We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills. Commitment At NXP. We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress. Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality. Thank you for considering a career at NXP. To help you prepare for the different steps in our hiring process, see the following useful advice and tips. Are you already an NXP employee? Do not apply here. Instead, you must apply via our internal career page.

Responsibilities

The Assembly Engineering Lead will manage site decisions in alignment with NXP values, focusing on process standardization and talent retention. They will collaborate with teams to ensure successful NPI/NTI launches and maintain business continuity in processes.