Start Date
Immediate
Expiry Date
07 Jul, 26
Salary
0.0
Posted On
08 Apr, 26
Experience
0 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Die bonding, Semiconductor manufacturing, Equipment maintenance, Troubleshooting, Cleanroom operations, Microscope usage, Hand tools, Automated machine operation, Epoxy application, Die placement, Quality control
Industry
Semiconductor Manufacturing