JOB REQUIREMENTS:

• 2-3 years’ experience in manufacturing environment would be an advantage
• Must have basic knowledge in Design of Experiment (DOE), SPC and other quality tools.
• Knowledge in copper etching, photosensitive film imaging processing.
• Experience in lead-frame or PCB etching manufacturing processes.
• Skillful in problem solving techniques using statistical tools and data analysis.
• Familiar with Microsoft Office software and project management skill.Salary will be commensurate with experience.
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  Qualification: Diploma or Bachelor Degree in Engineering (Mechanical or Manufacturing)

• Responsible for manufacturing process at Pilot Hole Stamping, Lamination and UV Exposure for lead frame at PES.
• To resolve all daily process and products’ quality issue.
• Responsible for improvement programs in Yield, Capacity, Cycle Time and Capability to achieve cost reduction.
• Perform 5W1H methodology to determine root cause and implement improvement actions on daily production lot rejects.
• Perform evaluation to optimize and improve the manufacturing process capability and yield for new products.
• Qualify new materials; processes, equipment and system for continue improvement.
• Establish and generate the process control, process FMEA and operation work Instruction documentation.
• Perform SPC review.
• Perform other duties that may be assigned by the superior from time to time