Backend Process Development Engineer (Junior-Senior) at IQM Quantum Computers

Espoo, Uusimaa, Finland -

Full Time

Start Date

Immediate

Expiry Date

05 Sep, 26

Salary

0.0

Posted On

07 Jun, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Solder Reflow, Flip-chip Interconnect, Under-bump Metallizations, Die Package Design, Cleanroom Operations, Process Qualification, Cryogenic Packaging, Solder Alloy Systems, Process Flow Design, Tool Configuration, Site-acceptance Testing, Contamination Control

Industry

Computer Hardware Manufacturing

Description

IQM is a global leader in designing, building, and selling superconducting quantum computers. IQM provides both on-premises full-stack quantum computers and a cloud platform to access its computers anywhere in the world. IQM customers include leading high-performance computing centers, research labs, universities, and enterprises with full access to IQM's software and hardware. IQM has over 300 employees with offices in Finland, Germany, France, Spain, Poland, Singapore, and the US. (www.meetiqm.com) We are expanding our backend and packaging activities targeting large quantum processor units (QPUs). As a Backend Process Development Engineer, you will contribute to planning and build-out of a cleanroom expansion dedicated to these processes. Your job duties will include process flow design, tool configuration, and vendor interactions. You will also have opportunities for hands-on operator work supporting process ramp-up and validation. Your work will directly impact the performance and scalability of IQM’s superconducting quantum computers, focusing on production readiness, high reliability, and quality control. What will I be doing? Develop, optimize, and characterize die packaging and backend processes for cryogenic and extreme-temperature environments Define and design backend processes from concept to production readiness Drive process transfer to production, including documentation, training, and qualification Specify, procure, and qualify new process tools Support site-acceptance testing (SAT), tool installation, tool health monitoring and maintenance and ramp-up activities in collaboration with the equipment team Contribute to cleanroom build-out together with external consultants and infrastructure teams Perform hands-on process implementation, testing, and validation Collaborate cross-functionally with wafer fab, QPU designers, test teams, operations, and facilities Interface with external tool vendors to evaluate capabilities and specifications What skills do I need? Proven experience with solder reflow and microbump / flip-chip interconnect processes Strong understanding of UBMs (Under-bump metallizations), and solder alloy systems Experience in die package design for cryogenic or extreme environments Demonstrated track record in setting up or scaling die packaging production lines Solid knowledge of cleanroom operations, contamination control, and process qualification Minimum 3 years of cleanroom operator experience BSc, MSc or PhD in Electrical Engineering, Applied Physics, or a closely related field Preferred skills that can be useful but are not mandatory: High pad-count dies and fine-pitch interconnects Mechanical and thermal design of die packages or interposers Electroplating and surface finishing processes Wave, laser, or selective soldering Failure analysis techniques (X-ray tomography, SEM, optical microscopy) Mask layout design for semiconducting or superconducting foundry processes Ceramic substrates, hermetic or vacuum packaging Microwave / RF fundamentals and impedance-controlled designs Vacuum technologies, cryostats, or low-temperature systems Advanced PCB design (high-frequency, rigid-flex, low-loss materials) Automated testing, probing, or pick-and-place systems Experience with superconducting materials or quantum device fabrication What can I expect from IQM? At IQM, you can expect to work on groundbreaking quantum hardware projects. Your work will directly contribute to the development and industrialization of next-generation quantum processor units, including large-scale systems, from defining backend process concepts to bringing new tools and cleanroom capabilities online and transferring them into production. You will thrive in a creative, open, and hands-on start-up environment where engineers are trusted with real responsibility. You will be encouraged to experiment, iterate, and continuously improve while working with cutting-edge tools and technologies. IQM offers a highly international and collaborative workplace, bringing together experts from diverse cultural and technical backgrounds. As a rapidly growing organization, IQM provides the opportunity to play a meaningful role in scaling both technology and operations. Meet our people and hear more about IQM by visiting our Youtube channel here Please note that only applications submitted through the website will be processed.

Responsibilities

Develop and optimize die packaging and backend processes for superconducting quantum processor units in cryogenic environments. Lead the planning and build-out of cleanroom expansions, including tool procurement, installation, and process transfer to production.