Bonding Application Manager at Applied Materials

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

05 Jun, 26

Salary

0.0

Posted On

07 Mar, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Bonding Technology, Application Development, Customer Engagement, Process Integration, Team Leadership, Technical Foundation, Problem-Solving, Data Analysis, Hybrid Bonding, Semiconductor Manufacturing, Roadmap Alignment, Software Collaboration

Industry

Semiconductor Manufacturing

Description

Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. What We Offer Location: Singapore,SGP You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. The Bonding Application Manager plays a critical role in advancing Applied Materials’ hybrid bonding technology by leading application development, driving customer engagement, and ensuring seamless integration of bonding solutions into advanced semiconductor manufacturing workflows. This role requires a strong technical foundation, customer‑facing experience, and the ability to lead a high‑performing engineering team to deliver innovative solutions that align with strategic business and technology roadmaps. Key Responsibilities Develop and Validate New Bonding Technologies: Collaborate with partners and customers in the research, development, and validation of cutting-edge technologies to enhance hybrid bonding processes. Resolve Customer Issues: Address and resolve high-value customer issues, leveraging technical expertise to deliver innovative solutions. Customer Engagement: Travel to meet customers, understand their requirements and pain points, and translate these insights into actionable strategies and solutions. Analyze Process Integration Impact: Evaluate the effects of upstream and downstream processes on hybrid bonding technology, ensuring seamless integration and optimization. Support Product Development Roadmap: work with the Head of Technology to drive the product development roadmap, aligning with business goals and technological advancements. Enhance Integration Value: Focus on enhancing the integration value of the hybrid bonding system, ensuring optimal performance and efficiency. Collaborate with Software Team: Work closely with the software team to develop capabilities that maximize the integration value of the hybrid bonding system. Innovate Integration Solutions: Identify and implement innovative solutions to improve the integration and functionality of hybrid bonding technology. Team Leadership: oversees a team of both new graduates and experienced engineers, providing coaching, technical guidance, and career development support to strengthen team capability and execution. Requirements Degree in Engineering, Materials Science, Physics, or related field (Master’s/PhD preferred). Experience in semiconductor process engineering, hybrid bonding, or advanced packaging. Strong customer‑facing, problem‑solving, and data‑analysis skills. Proven ability to lead and develop engineering teams. Willingness to travel for customer support and technology development. Work Location Science Park II (Moving to Tampines in end 2026) Additional Information Time Type: Full time Employee Type: Assignee / Regular Travel: Relocation Eligible: No Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

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Responsibilities

This role is responsible for advancing hybrid bonding technology by leading application development, engaging with customers, and ensuring the seamless integration of bonding solutions into semiconductor manufacturing workflows. Key duties include developing and validating new bonding technologies, resolving high-value customer issues, and driving the product development roadmap.