Camera Module Design Lead at Apple

Shanghai, Shanghai, China -

Full Time

Start Date

Immediate

Expiry Date

21 Jun, 26

Salary

0.0

Posted On

23 Mar, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Optics, Sensors, Actuator, Packaging, System Integration, Failure Analysis, Root-Cause Analysis, Statistical Analysis, Design Evaluation, Prototype Builds, Qualification, Debugging, Geometric Optics, Image Quality Evaluation, Module Manufacturing Processes, Cross-functional Team Leadership

Industry

Computers and Electronics Manufacturing

Description

Do you love taking on big challenges that require exceptionally creative solutions? Do you deeply understand how an incredible camera experience should work? As part of our Camera Technologies group, you’ll help design the innovative technology that allows each generation of Apple products to produce photos even more incredible than the last. You’ll design and develop groundbreaking ideas for everything involved in our camera systems, from sensor to lens. You’ll collaborate with teams across Apple to research, design, develop, test, and qualify camera hardware for Apple products. Together, we’ll craft a magical photography experience that redefines what millions of customers can expect from their cameras. Bring passion and dedication to your job and there's no telling what you could accomplish! The Camera Hardware Engineering group is responsible for all research, design, development, test, and qualification of camera hardware for Apple products. We are searching for extraordinary Hardware Engineers to take ownership in the development and system integration of very high-performance, compact camera modules and depth-sensing hardware. DESCRIPTION - Definition and trade-off studies of RGB camera and depth-sensing optics, sensors, actuator, and packaging. - Interaction with optical, electrical, process, controls systems, sensing, test, and mechanical teams on integration of camera/depth-sensing hardware into products. - Leadership of offshore manufacturing partners on camera/depth-sensing design evaluation, product prototype builds, and qualification. - Leadership of failure analysis and corrective action implementation at manufacturing sites as well as remotely, including assembly processes, testing, and calibration; parametric-data analysis of end-of-line yield and post-reliability failures. - Evaluation and debugging of camera/depth-sensing HW at module and product levels for Camera Design and Integration. - Documentation of camera-specific design, test, and manufacturing requirements. - International travel may be required to supplier facilities for product development and production bring-up. MINIMUM QUALIFICATIONS BSc/MSc/PhD in relevant field (Electrical Engineering, Mechanical Engineering, Optics, Physics, Materials or equivalent). PREFERRED QUALIFICATIONS For BSc candidate, 3+ years working experience in optomechanical products or semiconductor is preferred. Ability to lead a multi-functional team of engineers and scientists with unique background and technical expertise through the R&D phase of product development from concept to mass production. Ability to influence cross-functional teams, manage risk, make decisions with limited amount of information, deliver against a fast-paced development schedule. Able to communicate and convey ideas clearly and concisely. The applicant will also be familiar with at least 3 of the skills listed below: Camera module or imaging system design and architecture, including optical components, optical sensing, and system integration. Design and tolerance analysis of highly constrained, high-volume actuators or translational mechanisms. Electronic circuit and system design including power delivery, high-speed signal integrity, electrical integration of sensor interfaces. Understanding of geometric optics and image quality evaluation, including test charts, algorithms, and lighting. Image/depth sensor design or characterization. Compact module manufacturing processes such as sensor attachment, flex attachment, active alignment, etc. Failure analysis techniques including optical microscopy, X-ray, CT scans, SEM, etc. Ability in root-cause and corrective-action analysis. Proficiency in statistical analysis, data reporting, and visualization. Proven track record of successfully delivering new products into mass production on time, meeting yield and efficiency targets.

Responsibilities

This role involves defining and conducting trade-off studies for RGB camera and depth-sensing components, including optics, sensors, actuators, and packaging. The lead will also manage offshore manufacturing partners for design evaluation, prototyping, and qualification, alongside leading failure analysis and corrective action implementation.