Camera Process Development Engineer at Apple

Shenzhen, Guangdong, China -

Full Time

Start Date

Immediate

Expiry Date

28 Apr, 26

Salary

0.0

Posted On

28 Jan, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Process Development, Failure Analysis, Root Cause Analysis, Design Of Experiment, Engineering Statistics, Metrology Tools, Quantitative Measurement, Flip Chip Bonding, Wire Bonding, Pick And Place, Dispensing, Curing, Flex Attach, Optical Assembly, Supplier Management

Industry

Computers and Electronics Manufacturing

Description

Apple is a place where extraordinary people team up to do their best work. Come and be part of this team that is responsible for the innovative making of the latest Apple products. The Camera Hardware Engineering group is responsible for all research, design, development, and test of camera and depth hardware for Apple products. This team is seeking a Process Development Engineer to lead new manufacturing process development for camera modules and components. DESCRIPTION Work with vendors to develop & optimise mass production intent equipment, process and materials to meet key deliverables (Yield, Reliability, UPH, etc). Provide technical leadership (failure analysis, root cause analysis, DOEs etc) in resolving development issues. Define and establish procedures, metrologies & process requirements. Review and buy-off machine setup and process conditions for engineering builds. Report and update development status to cross-functional team. Develop vendor capability to meet Apple standards. Travel to vendor sites would be required. MINIMUM QUALIFICATIONS Degree of Science in Engineering or equivalent. Minimum 5 years of experience in process or new product development. Hands-on experience in any relevant semiconductor processes such as flip chip, flex attach, pick and place, dispensing, curing, active alignment etc. Proficiency in English (written & spoken) PREFERRED QUALIFICATIONS Good knowledge in design of experiment (DOE), engineering statistic (JMP, Minitab), root cause analysis and problem solving. Familiarity on different metrology tools and quantitative measurement methodology. Clear and effective written, presentation and communication skill. Knowledge and work experience in one or more of the following processes & handling such equipment - Flip Chip bonding (Thermosonic, Thermocompression etc) or Wire bonding. High accuracy pick & place (die attach etc) Dispensing (bonding, underfill, encapsulation etc) Curing (UV, thermal, reflow, snapcure etc) Flex Attach (ACF, hotbar etc) Solder Jetting or Laser Wire Soldering Optical assembly (active alignment, lens pre-focusing etc) SMT (e.g. solder printing, component pick&place, AOI, SPI and reflow) Knowledge on adhesive or epoxy or other bonding material is an advantage. Understand cleanroom protocols and contamination controls. Experience with supplier management (subcontractors, equipment, material or component vendors etc).

Responsibilities

Lead new manufacturing process development for camera modules and components. Work with vendors to develop and optimize mass production intent equipment, processes, and materials.