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Central Mask Tapeout Engineer at Micron Technology

Boise, Idaho, United States -

Full Time

Start Date

Immediate

Expiry Date

13 Jan, 26

Salary

0.0

Posted On

15 Oct, 25

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Tapeout, Fracture, Metrology, Problem-Solving, Analytical Skills, Attention to Detail, Semiconductor Manufacturing, Mask Engineering, Collaboration, Process Improvement, Documentation, Data Analysis, Technical Supervision, Reticle Specifications, Global Fab Operations, Automation Tools

Industry

Semiconductor Manufacturing

Description

Perform daily tapeout Ensure timely delivery of high-quality reticles to all global fabs, meeting both technical and logistical requirements. Collaborate with cross-functional teams to define reticle specifications and optimize fracture and tapeout flows. Troubleshoot metrology issues and implement corrective actions to maintain reticle quality standards. Foster a culture of constant improvement within reticle tapeout processes and workflows. Support integration of new technologies and process improvements into the reticle manufacturing pipeline. Maintain documentation and reporting for reticle performance, delivery metrics, and process changes. Bachelor's degree in Engineering, Physics, Materials Science, or a related field, or equivalent experience. Experience in semiconductor manufacturing or mask/reticle engineering. Strong understanding of tapeout, fracture, and metrology processes. Established proficiency in teaming across functions and supervising technical outputs. Excellent problem-solving and analytical skills with attention to detail. Master's degree or equivalent experience in a relevant technical field. Experience with global fab operations and reticle logistics. Familiarity with automation tools and data analysis software used in mask engineering.

Responsibilities

Perform daily tapeout and ensure timely delivery of high-quality reticles to global fabs. Collaborate with cross-functional teams to define reticle specifications and optimize fracture and tapeout flows.