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Core Technologist, Wire Saw Subject Matter Expert at Corning Research Development Corporation

Hemlock, Michigan, United States -

Full Time

Start Date

Immediate

Expiry Date

14 Aug, 26

Salary

157000.0

Posted On

16 May, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Diamond Wire Saw Process, Silicon Wafer Slicing, Process Optimization, Root Cause Analysis, Technical Troubleshooting, Yield Improvement, Equipment Maintenance, Technical Training

Industry

Glass;Ceramics and Concrete Manufacturing

Description

Advertisement Solar Technology LLC seeks Core Technologist, Wire Saw Subject Matter Expert to work in Hemlock, MI. Serve as technical expert to support wire saw operations & wafer slicing processes. Use diamond-coated wire saw to slice silicon wafers & improve solar wafer products. Identify opportunities for process optimization & drive process developments to improve yield, reduce costs, & enhance efficiency of solar wire saw operations & processes. Troubleshoot technical issues to identify root causes & implement corrective actions. Train engineers, technicians, & operators on solar wire saw operations. Req: bachelor’s in mechanical engineering, materials science, or chemical engineering, or closely related. 5 yrs. exp.: using diamond wire saw process to slice silicon wafers. 5 yrs. exp: working on diamond wire saw process equipment & determining technical issues to produce high quality wafers; troubleshooting & problem-solving issues w/ diamond wire saw equipment; & working w/ diamond wire quality & wire saw equipment components to understand the impact on wire saw process & wafer quality. Send resume referencing “2772” to Cassandra Tuckey at careers@corning.com or One Riverfront Plaza, Corning, NY 14831. Rate of Pay: $157,000/year

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Responsibilities

Serve as the technical expert for wire saw operations and wafer slicing processes to improve solar wafer products. Focus on process optimization, troubleshooting technical issues, and training staff to enhance efficiency and yield.