Piper Companies is looking for a CoWoS Principle Packaging Engineer who will construct and enhance Chip-on-Wafer-on-Substrate packaging technology to support high-performance AI and data center applications onsite in Saratoga, CA. The ideal CoWoS Principle Packaging Engineer will collaborate with cross-functional teams to facilitate smooth integration of advanced multi-die packages.

QUALIFICATIONS FOR THE COWOS PRINCIPLE PACKAGING ENGINEER:

• 15+ years’ experience in advanced semiconductor packaging and interconnect processes.
• Demonstrated expertise in CoWoS / FOCoS, or FOWLP and proficient in EMIB, InFO, and advanced 2.5D/3D integration technologies.
• Deep knowledge of thermal management, reliability testing, and signal/power integrity challenges.
• Proven experience working with TSMC and leading OSATs.
• Must be eligible to work in the United States and obtain and maintain an Active U.S. Government Secret Clearance.
• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.

• Lead the advancement of CoWoS packaging technology to enhance chip performance, power, and reliability.
• Develop and enhance CoWoS packaging processes to ensure superior thermal, mechanical, and electrical performance.
• Work closely with cross-functional design, test, and manufacturing teams for seamless chip-package integration.
• Implement strategies to enhance yield and address failure modes across packaging flows.