About the job

• We are seeking a highly motivated and experienced Principal Engineer – SoC Physical Design or Chip-Level Expert to lead the implementation of complex ASIC/SoC designs from architecture definition through successful tape-out. The ideal candidate will have deep expertise in full-chip physical design, SoC integration, advanced-node implementation, and cross-functional technical leadership.This role requires a strong hands-on technical leader who can drive methodology, execution, and signoff while collaborating closely with Architecture, RTL, Verification, DFT, STA, Package, and Silicon Validation teams. Key Responsibilities Partner with Front-End and Architecture teams to understand chip architecture and drive physical design considerations early in the development cycle.
• Lead full-chip physical implementation activities including floorplanning, power planning, clock implementation, place-and-route, timing closure, and signoff.
• Drive physical design methodologies, best-known methods (BKMs), checklists, and implementation guidelines across projects.
• Serve as the technical focal point for physical design execution and coordinate activities across block, subsystem, and top-level implementation teams.
• Define project milestones, track progress, manage dependencies, and drive execution to meet tape-out schedules.
• Collaborate with STA, DFT, RTL, Verification, Power Integrity, and Packaging teams to achieve project goals.
• Drive closure of timing, congestion, power, IR drop, EM, signal integrity, and physical verification requirements.
• Debug and resolve design, flow, and methodology issues, identifying scalable solutions and driving implementation.
• Mentor engineers and contribute to the continuous improvement of design methodologies and automation flows.
• Required / Preferred Qualifications B.Tech / M.Tech in Electrical Engineering, Electronics, Computer Engineering, or related discipline.
• 15+ years of ASIC/SoC Physical Design experience.
• Proven track record of multiple successful SoC/ASIC tape-outs.
• Strong understanding of ASIC/SoC integration, including floorplanning, clock distribution, power distribution networks, global signal planning, I/O planning, and hard IP integration.
• Experience addressing complex SoC challenges involving multiple voltage domains, multiple clock domains, ESD implementation strategies, mixed-signal integration, and package-aware design considerations.
• Solid knowledge of hierarchical and top-down design methodologies, budgeting techniques, timing convergence, and physical convergence strategies for large-scale SoCs.
• Experience integrating IPs from both internal and external vendors and driving physical implementation requirements throughout the design lifecycle.
• Hands-on experience with large-scale SoCs exceeding >20M gates and operating at frequencies greater than 1GHz.
• Strong understanding of physical design databases, data management, and implementation-signoff consistency.
• Experience in advanced technology nodes including 22nm, 16nm, 7nm, 5nm, and below.
• Strong leadership skills with the ability to drive execution across geographically distributed teams.
• Experience leading or contributing to multiple successful full-chip SoC tape-outs with ownership of implementation, timing closure, power integrity, physical verification, and signoff.
•  Tools Required Synopsys: Fusion Compiler (FC), ICC2, PrimeTime (PT), StarRC, PrimePower.
• Cadence: Innovus, Tempus, Voltus, Quantus.
• Physical Verification: Calibre, IC Validator (ICV), Pegasus.
• Power Integrity & Signoff: RedHawk, Voltus, PrimePower.
• Scripting & Automation: TCL, Perl, Python, Shell scripting.