DCP-Fluid Dynamics Engineering(Global)-Shenzhen at Vertiv

Nanshan District, Guangdong, China -

Full Time

Start Date

Immediate

Expiry Date

21 Sep, 26

Salary

0.0

Posted On

23 Jun, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Thermal Requirement Analysis, FEA Simulation, CFD Simulation, Thermal Verification, Cooling Technologies, Heat Transfer, Creo, FloEFD, Flotherm, 6 Sigma ET, Icepack, Problem Solving, Communication, Teamwork, English Proficiency

Industry

electrical;Appliances;and Electronics Manufacturing

Description

Responsibilities: 1. Responsible for thermal requirement analysis, solution optimization, FEA simulation and verification of datacenter power module/shelf/rack new products development. 2. Seek for cost effective and innovative cooling technologies using fan, heatsink, heat pipe, cold plate, liquid cooling, immersion cooling etc. 3. Cooperate to build prototypes, perform thermal verification tests and solve thermal test issues. 4. Draft the thermal design CBB/technical instruction and patent documents. 5. Lead the pre-study project related to thermal management by learning the industry/competitor’s technology. Qualifications: 1. Bachelor's degree or above in mechanical, fluid and thermal engineering. 2. Proficient in using CFD simulation tools such as FloEFD, Flotherm, 6 Sigma ET, Icepack etc. and skill of CAD tool Creo is a plus. 3. Solid knowledge on heat transfer phenomena and strong logic/problem solving skills. 4. Good at communication and teamwork. 5. Fluent oral & written English is a plus. Work Authorization No calls or agencies please. Vertiv will only employ those who are legally authorized to work in the United States. This is not a position for which sponsorship will be provided. Individuals with temporary visas such as E, F-1, H-1, H-2, L, B, J, or TN or who need sponsorship for work authorization now or in the future, are not eligible for hire. Equal Opportunity Employer We promote equal opportunities for all with respect to hiring, terms of employment, mobility, training, compensation, and occupational health, without discrimination as to age, race, color, religion, creed, sex, pregnancy status (including childbirth, breastfeeding, or related medical conditions), marital status, sexual orientation, gender identity / expression (including transgender status or sexual stereotypes), genetic information, citizenship status, national origin, protected veteran status, political affiliation, or disability.

Responsibilities

Responsible for thermal analysis, FEA simulation, and verification for datacenter power modules and rack products. The role involves developing innovative cooling solutions and leading pre-study projects on thermal management.