Development and Integration Engineer for MEMS technology (f/m/div.) at Bosch Group

Dresden, Saxony, Germany -

Full Time

Start Date

Immediate

Expiry Date

05 Oct, 26

Salary

0.0

Posted On

07 Jul, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

MEMS Technology, Semiconductor Process Development, Integration Engineering, Sensor Technology, Micromechanics, Analytical Methods, Technical Leadership, Project Scheduling, Feasibility Evaluation, Process Release Management

Industry

Software Development

Description

Company Description Bosch Sensortec GmbH is a technology leader in sensing solutions based on microelectromechanical systems (MEMS) and dedicated to the consumer electronics world. We develop and market key technologies for smartphones and tablets, hearables, wearables, smartglasses, augmented and virtual reality applications, gaming devices and many more. Our sensors improve people’s well-being and lifestyle and enable consumer electronic devices to sense the world around us. MEMS sensors are therefore an essential part of the foundation for a connected world. Bosch Sensortec GmbH is a wholly owned subsidiary of Robert Bosch GmbH. Bosch Sensortec GmbH is looking forward to your application! Job Description To strengthen our leading market position within the MEMS sensor market we will extend our MEMS technology to 300 mm wafer. We are looking for a curious and technology-driven engineer (f/m/div.) with a broad understanding of semiconductor and MEMS process development. If you enjoy connecting the dots between different technologies, challenging technical boundaries, and turning complexity into manufacturable solutions, this role is for you. As a Development and Integration Engineer for MEMS technology (f/m/div.) you will drive and control innovative technology developments for complex products with a focus on integration (including scheduling and customer interface) Part of your responsibilities is implementing development goals together with your team of experts; you will achieve these goals through a combination of intensive, collaborative work, a high degree of personal responsibility and independence In addition, you will utilize new technologies and materials and perform both technical and economic evaluation of the feasibility of new processes You coordinate internal interfaces in development and manufacturing to develop solutions and control their implementation from start of development until they are ready for series production You will be responsible for cooperation with research institutes for basic development and for managing quality assessments and process releases Qualifications Personality: Self-initiated, assertive, creative, strong team player, goal-oriented Working Practice: Systematic, proactive, resilient Experience and Know-How: Multiple years of relevant professional experience; very good knowledge in sensor, micromechanics and semiconductor technology required; knowledge of relevant analytical methods beneficial; excellent understanding of physical principles and interrelationships; ability to guide a team in technical matters Language: Very good knowledge of English, proficient German Education: Completed university studies (Master/Diploma/PhD) in engineering or natural sciences, physics, chemistry, material sciences or a comparable qualification Additional Information We offer flexible working models: from various part-time options to mobile working and job sharing. Feel free to contact us. Diversity and inclusion are not just trends for us but are firmly anchored in our corporate culture. Therefore, we welcome all applications, regardless of gender, age, disability, religion, ethnic origin or sexual identity. Need support during your application? Samuel Zinn (Human Resources) +49 7121 35-33717 Need further information about the job? Christina Leinenbach (Functional Department) +49 712135-33480 Legal Entity: Bosch Sensortec GmbH

Responsibilities

Drive and control innovative technology developments for complex MEMS products with a focus on integration and 300 mm wafer extension. Coordinate internal interfaces between development and manufacturing to ensure solutions are ready for series production.