MINIMUM QUALIFICATIONS

• Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field
• 5+ years experience in III-V semiconductor Front End of Line device integration
• 5+ years experience in semiconductor manufacturing processes
• 2+ years experience in at least one of device integration areas wet processes, lithography, etch, or deposition
• Experience in semiconductor physics, materials science and epitaxy
• Experience with project management techniques, DOE, and statistical analysis
• Proven experience in cross functional collaboration and clear communication in ambiguous environments

PREFERRED QUALIFICATIONS

• PhD in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field
• Demonstrated experience in LED or MicroLED design and processing
• Demonstrated experience in III-V material systems and MOCVD epitaxy
• Demonstrated experience with problem solving, root cause analysis and troubleshooting complex issues
• Experience with data analysis tools and software (e.g., Python, R, Tableau, JMP)
• Experience with process optimization for reliability and continuous yield improvement

• Design and Development: Invent, design, and develop integration schemes and device concepts for micro-LEDs at internal facilities suited for display panels productization
• Project Planning and Management: Build and manage project plans for material being run at internal and external facilities
• Collaboration and Testing: Work with cross-functional partners to test and characterize uLED devices
• Data Analysis: Work with large sets of data to assess performance, yield, and reliability, and drive clear outcomes from Design of Experiments (DOE)
• Risk Assessment and Mitigation: Carry out risk assessment and mitigation for key integration modules and device performance trade-offs
• Internal R&D Partnerships: Engage with internal R&D partners to understand and drive technical outputs
• Experimental Material Management: Follow and disposition of experimental material targeting fast cycle times
• Process Optimization: Optimize process modules for flexibility and stability in supporting fast prototyping flows
• Close engagement with MOCVD epitaxy experts working on device performance continuous improvement and new device concepts for next generation AR display panels