Die Preparation Process Development Engineering at Sandisk

Shanghai, Shanghai, China -

Full Time

Start Date

Immediate

Expiry Date

11 Jun, 26

Salary

0.0

Posted On

13 Mar, 26

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Die Preparation, Process Development, ASIC Wafer, Flip Chip Wafer, 3D NAND Wafer Assembly, Recipe Development, Cost Down, Technology Evaluation, Material Evaluation, Machine Evaluation, SEM, FIB, TEM, EDX, Communication, Team Work

Industry

Semiconductor Manufacturing

Description

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Job Description Die Preparation (DP) process evaluation for ASIC wafer, flip chip wafer and 3D NAND wafer assembly. New DP process recipe development to achieve high quality product and cost down. New DP technology evaluation and introduction. Co-work with material/machine team with new package related material machine evaluation. Co-work with objective owner to handle new product DP process. Qualifications REQUIRED: Master degree in microelectronic science and technology or in material science and technology. English communication skills: CET-6, be fluent both in oral and written English. Basic understanding of assembly process flow & materials property. Basic Computer & Microsoft Office skills are required, AutoCAD/Cadence/JMP are preferred. Be capable of analyzing SEM/FIB/TEM/EDX results, operating is preferred. Good communication/team work/planning skills. Be capable of occasionally over time work and oversea business travel. Prefer to have 1-2 years related working experiences. Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying. Job Type (exemption status): Exempt position - Please see related compensation & benefits details below Business Function: Packaging Engineering Work Location: Shanghai SNDK Minhang Office--LOC_SNDK_Shanghai SNDK Minhang

Responsibilities

This role involves die preparation process evaluation for ASIC, flip chip, and 3D NAND wafer assembly, focusing on developing new process recipes to achieve high product quality and cost reduction. The engineer will also evaluate and introduce new die preparation technologies and collaborate with material and machine teams on new package-related evaluations.