Director, Advanced Packaging Technology Development at Micron Technology

Taichung, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

11 Feb, 26

Salary

0.0

Posted On

13 Nov, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Advanced Packaging Solutions, Collaboration, Strategic Development, Quality Improvement, Cost Control, Production Efficiency, Technical Leadership, Process Flows, Problem Solving, Team Leadership, Communication Skills, Presentation Skills, Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering

Industry

Semiconductor Manufacturing

Description

Your responsibilities include but are not limited to collaborating with internal and external partners to building and implement strategies aligned to organizational and business objectives by delivering high performing and cost-effective advanced packaging solutions on time with highest quality and predictable reliability performance. Develop and Communicate Advanced Packaging Technology Development Strategy: Develop and communicate Advanced Packaging Technology Development strategic objectives Understand the impact and implications of APTD strategy to the overall company strategy and direction Apply knowledge to achieve quality improvements, cost control, and production efficiency Ensure accuracy, quality, and timeliness of results Guide best utilization of resources to achieve end results Ensure critical results, milestones and goals are met by the team Provide recommendations to achieve organization objectives and align group to support department objectives. Set strategic and long-term technical objectives and insure they are aligned with department objectives Demonstrate understanding of technology complexity and effective technology decision making Provide technical leadership that may influence company direction Represent APTD in providing cross department leadership in area of responsibility Work effectively with peers in other department to develop and drive multi-functional initiatives B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields 15 or more years of semiconductor process or equipment development experience, preferably in wafer bonding, plating, warpage control and packaging field Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability Ability to use extensive technical knowledge to guide strategic directions Consistent track record to solve problems and address root causes Tenacity to work effectively under timelines and limited resources Validated ability to lead small and large teams, directly or indirectly, toward common goals Outstanding communication and presentation skills, written and verbal to all levels of an organization

Responsibilities

The Director of Advanced Packaging Technology Development is responsible for collaborating with partners to implement strategies that align with organizational objectives. This role includes developing and communicating strategic objectives and ensuring the delivery of high-performing packaging solutions.