Director, Advanced Packaging Technology Development at Micron Technology

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

11 Apr, 26

Salary

0.0

Posted On

11 Jan, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Advanced Packaging Solutions, Technical Leadership, Multi-functional Leadership, Quality Improvements, Cost Control, Production Efficiency, Process Flows, Problem Solving, Team Leadership, Communication Skills, Mentoring, Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics

Industry

Semiconductor Manufacturing

Description

Your responsibilities include but are not limited to collaborating with internal and external partners to building and implement strategies aligned to organizational and business objectives by delivering high performing and cost-effective advanced packaging solutions on time with highest quality and predictable reliability performance. Develop and Communicate Advanced Packaging Technology Development Strategy: Develop and communicate Advanced Packaging Technology Development strategic objectives Understand the impact and implications of APTD strategy to the overall company strategy and direction Technical Leadership: Set strategic and long-term technical objectives and insure they are aligned with department objectives Demonstrate understanding of technology complexity and effective technology decision making Provide technical leadership that may influence company direction Multi-functional Leadership: Represent APTD in providing cross department leadership in area of responsibility Work effectively with peers in other department to develop and drive multi-functional initiatives Impact and Execution: Apply knowledge to achieve quality improvements, cost control, and production efficiency Ensure accuracy, quality, and timeliness of results Guide best utilization of resources to achieve end results Ensure critical results, milestones and goals are met by the team Provide recommendations to achieve organization objectives and align group to support department objectives. Make decisions that directly impact the achievement of work unit and sub-function objectives Growth Mindset: Continue to build new skills through development goals and learning events. Seek out opportunities to work multi-functionally, build a network, and gain competency across domains Leadership Development: Mentor, develop and motivate leaders and team members Cultivate effective team and leadership abilities B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields 10 or more years of semiconductor process or equipment development experience, preferably in wafer bonding, plating, warpage control and packaging field Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability Ability to use extensive technical knowledge to guide strategic directions Consistent track record to solve problems and address root causes Tenacity to work effectively under timelines and limited resources Validated ability to lead small and large teams, directly or indirectly, toward common goals Outstanding communication and presentation skills, written and verbal to all levels of an organization

Responsibilities

The Director will collaborate with partners to develop and implement strategies for advanced packaging solutions. They will also provide technical leadership and ensure that objectives align with departmental and organizational goals.