Director, Process Engineering (Advanced Packaging) at ASM

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

02 Mar, 26

Salary

0.0

Posted On

02 Dec, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Process Development, Hybrid Bonding, Advanced Packaging, Equipment Integration, Team Leadership, Customer Engagement, Technology Roadmaps, Budget Management, Industry Trends, Thin-Film Deposition, Surface Preparation, CoWoS, TSV Fan-Out, Communication Skills, Cross-Functional Collaboration, Troubleshooting

Industry

Computers and Electronics Manufacturing

Description

Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential. Job's mission As Director of Process Technology for Advanced Packaging, you will lead the development and integration of cutting-edge semiconductor processes that power ASM’s next-generation equipment portfolio. Your expertise in hybrid bonding and advanced packaging will drive technology roadmaps, ensuring process stability and scalability from concept to high-volume manufacturing. Partnering with global teams and customers, you will accelerate innovation and deliver solutions that shape the future of semiconductor technology. What you will be working on Define and execute process technology roadmaps for advanced packaging equipment, aligning with product strategy and presenting to executive management. Lead process development through the full Product Life Cycle (PLC), ensuring stability, repeatability, and scalability. Manage process development budgets, including resource allocation and ROI on R&D investments. Build and lead high-performing process engineering teams, fostering collaboration with R&D, product management, and field support. Engage with customers during demos, on-site qualifications, and technology transfers to accelerate adoption. Negotiate process-related agreements with partners and customers for joint development programs. Track industry trends in advanced packaging to maintain competitive process leadership. What we are looking for Bachelor’s degree in Chemical Engineering, Materials Science, Physics, or related field. Minimum 15 years of experience in semiconductor process development, with at least 8 years in equipment-level process integration. Proven leadership experience managing process teams and driving technology strategies. Deep technical expertise in hybrid bonding, CoWoS, TSV fan-out, thin-film deposition, and surface preparation. Hands-on experience leading process development through full PLC for semiconductor equipment. Strong customer-facing experience, including demos, qualifications, and troubleshooting. Excellent communication and leadership skills; comfortable in global, cross-functional environments. Willingness to travel up to 30%. What sets you apart MS or PhD in a relevant field. Prior leadership as KPU or deputy KPU process head within a business unit. Demonstrated ability to present technical strategies to executive leadership. Apply today to be part of what’s next. We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect. To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube. ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

Responsibilities

Lead the development and integration of semiconductor processes for advanced packaging equipment. Manage process development budgets and build high-performing engineering teams to drive innovation.