Director, Product and Test Engineering at Infineon Technologies AG Australia

Malacca City, Malacca, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

17 Feb, 26

Salary

0.0

Posted On

19 Nov, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Semiconductor Fabrication, Backend Packaging, Test Engineering, Power Devices, Leadership, Communication, Analytical Skills, Problem-Solving, Data-Driven Decision-Making, Cross-Functional Team Leadership, Strategic Initiatives, Quality Improvement, Cost Reduction, Yield Improvement, New Product Introduction, Collaboration

Industry

Semiconductor Manufacturing

Description

Strong background in semiconductor BE packaging manufacturing and/or fabrication, specifically in Power Devices, with a minimum of 15 years of experience and at least 5 years of management experience. Requires exceptional technical expertise, strong leadership skills, and the ability to drive strategic initiatives. Responsible for leading cross-functional teams to develop and implement strategies for yield, cost, quality, and test improvements for Power Modules and Power Chip Embedded (CE) IC products at OSAT subcons in Malaysia, Thailand, Vietnam, China and other countries. Supporting introduction of new products, processes, and test methodologies, as well as collaborating with internal stakeholders in USA and Europe to ensure alignment with business objectives. Bachelor of Science in Electrical Engineering or other engineering fields, such as Mechanical Engineering, Computer Engineering, or Materials Science. Master of Science (MS) degree in Electrical Engineering or other engineering fields is highly preferred. Minimum 15 years of experience in semiconductor fabrication and/or backend packaging, specifically in Power Devices. At least 5 years of management experience, with a proven track record of leading high-performing teams Strong technical skills in semiconductor fabrication, backend packaging, and test engineering, with a deep understanding of Power Devices and Power IC products. Excellent leadership and communication skills, with the ability to motivate and inspire teams to achieve exceptional results. Strong analytical and problem-solving skills, with experience in data-driven decision-making Ability to work in a fast-paced environment, with multiple priorities and deadlines. We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.

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Responsibilities

Lead cross-functional teams to develop and implement strategies for yield, cost, quality, and test improvements for Power Modules and Power Chip Embedded IC products. Support the introduction of new products, processes, and test methodologies while collaborating with internal stakeholders to ensure alignment with business objectives.