Director, System in Package Architecture at SK hynix America

San Jose, California, United States -

Full Time

Start Date

Immediate

Expiry Date

05 Oct, 26

Salary

300000.0

Posted On

07 Jul, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Advanced Packaging Architecture, System in Package (SiP), High Bandwidth Memory (HBM), 2.5D Packaging, 3D Packaging, Signal Integrity (SI), Power Integrity (PI), SOC Integration, Electrical Engineering, Team Leadership, Cross-functional Alignment, Mechanical Test Vehicle Design

Industry

Semiconductor Manufacturing

Description

Job Title: Director, System in Package Architecture Office Location: San Jose, CA Work Model: Onsite About SK hynix America At SK hynix America, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape. We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We're not just adapting to technological change – we're driving it, with significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of what's possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing. Responsibilities: Lead the end-to-end development of advanced packaging system architectures to maximize System in Package (SiP) performance, with a specific focus on High Bandwidth Memory (HBM). Drive mechanical and electrical test vehicle design and development when necessary. Spearhead research and development of novel technologies to enhance SiP performance, driving the roadmap for SOC and HBM integration in 2.5D and 3D packaging environments. Lead strategic collaborations with internal teams and external partners to ensure seamless technology development and time-to-market. Minimum Qualifications: BS in Electrical Engineering or equivalent combination of education and progressive industry experience. 7+ years of specialized experience in advanced packaging architecture definition, strategy, and development. Demonstrated success in driving cross-functional alignment across engineering, product, and operations teams to deliver complex solutions. Proven track record of leading, mentoring, and scaling high-performing engineering teams, with experience managing managers or team leads preferred. Exceptional verbal and written communication skills, with the ability to articulate technical strategies. Preferred Qualifications: Master’s degree or PhD in Electrical Engineering, Materials Science, or related field. 10+ years of experience in advanced packaging architecture, specifically with 2.5D and 3D packaging technologies. Expert working knowledge of 2.5D/3D packaging technologies and large body substrate technologies. Strong proficiency in Signal Integrity (SI) and Power Integrity (PI) analysis and optimization. Direct experience in High Bandwidth Memory (HBM) architecture and integration is highly desirable. Benefits: Top Tier health insurance at no employee cost Paid day offs: PTO + Company Holidays + Happy Fridays Paid Parental Leave Program 401k Matching Educational reimbursement up to $10,000 per year Donation Matching and volunteering opportunities Corporate discount programs Free Breakfast/Lunch/Dinner provided to employees Equal Employment Opportunity: SKHYA is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws. Compensation: Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process. Pay Range $240,000—$300,000 USD

Responsibilities

Lead the end-to-end development of advanced packaging system architectures with a focus on High Bandwidth Memory (HBM). Drive the roadmap for SOC and HBM integration in 2.5D and 3D packaging environments through strategic collaborations.