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DMTS - Package Health, APTD at Micron Technology

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

11 Feb, 26

Salary

0.0

Posted On

13 Nov, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Semiconductor Packaging, Test Engineering, Reliability Engineering, Test Architectures, Package Simulation, Characterization, DRAM Testing, ASIC Testing, Packaging Fail Modes, Material Interaction, Technical Team Management, Cross-Functional Projects, Simulation Tools, Data Analytics, AI/ML Applications, Problem-Solving

Industry

Semiconductor Manufacturing

Description

Defines, leads, and drives complex, multi-disciplinary or domain-specific projects that are of critical importance to the organization. Has delivered multiple key innovations that have been efficiently implemented and widely adopted in products. Serves as a recognized technical spokesperson within the organization, providing expert-level analysis and guidance to team members and management on project, technical, and innovation-related matters. Acts as the focal point and acknowledged authority in their area of expertise. Actively develops and mentors others, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning and perfection. Participates actively in internal technology events such as conferences, workshops, and forums, sharing knowledge and driving teamwork across teams. Master's or Bachelor's degree in Electrical Engineering, Materials Science or related field. 10+ years of experience in semiconductor packaging, test, or reliability engineering (complex products preferred). Experience defining test architectures, coverage, and managing test/probe yield. Experience in package simulation and characterization (mechanical, thermal, electrical). Strong knowledge of DRAM or ASIC product testing, test architecture, and packaging fail modes. Strong knowledge of semiconductor packaging process, material interaction and properties. Experience managing technical teams and cross-functional projects. Knowledge of simulation tools and data analytics platforms. Familiarity with AI/ML applications in manufacturing or reliability. Experience with package characterization techniques and standards. Proven problem-solving and multitasking skills. Strong communication and stakeholder management skills.

Responsibilities

Defines and leads complex, multi-disciplinary projects critical to the organization. Acts as a recognized technical spokesperson, providing expert analysis and guidance while mentoring team members.