Engineer, Advanced Packaging Integration Engineering at Micron Technology

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

03 Mar, 26

Salary

0.0

Posted On

03 Dec, 25

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Advanced Packaging Technologies, Process Integration, Yield Improvements, Cost Reduction, Product Quality, Manufacturability, Reliability, Testing, Root-Cause Problem Solving, Communication Skills, Leadership Potential, Collaboration, Technology Development, Process Documentation, Semiconductor Industry, Quality Control

Industry

Semiconductor Manufacturing

Description

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. Technology Development: Develop and enable advanced package technology for various post-fab wafer finish and assembly processes Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity Integrate semiconductors while partnering with process and product engineering teams Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements Ensure defense coverage through process, measurement, inspection, and testing Establish correlations between defense mechanisms to identify improvement opportunities Work closely with internal and external partners to build and implement technology development strategies aligned with organizational and business objectives Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control Ensure smooth transition from new product development, qualification, small volume production to high volume production Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities B.S/M.S./Ph.D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or other related technical fields Experiences in semiconductor process integration will be advantageous Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering team Ability to resolve complex issues through root-cause or model-based problem solving Tenacity to work effectively under timelines and limited resources Consistent track record to solve problems and address root causes Good communication skills Keen in the semiconductor industry Showcase leadership potential

Responsibilities

Develop and enable advanced packaging technologies to meet various performance and quality requirements. Collaborate with multiple engineering teams to integrate manufacturing processes for optimal performance and ensure smooth transitions from development to production.