Engineer, HIG-HBM Product Engineering (Media Health Reliability) at Micron Technology

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

08 Jan, 26

Salary

0.0

Posted On

10 Oct, 25

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Reliability Test Flow Development, Project Management, Root Cause Analysis, Cross-Functional Collaboration, Electrical Failure Analysis, Physical Failure Analysis, Process Conversions, Risk Management, Mentorship, Technical Decision Making, Data Analysis, CMOS Technology, DRAM Device Physics, Quality Assurance, Manufacturing Test Flows, Problem Solving

Industry

Semiconductor Manufacturing

Description

Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects. Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution. DPM reduction: Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI's Quality, Cost and Cycle Time Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration. Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies. Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability. Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization. Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions. Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development. Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products. Bachelors/Masters in Electrical and Electronics Engineering Degree or related field. Product Engineering experience is preferred. Demonstrating Strong Leadership Skills and Technical Skills, especially in problem solving with root cause understanding and solution space through in depth circuit analysis. Basic understanding of CMOS technology and DRAM device physics and design. Good knowledge of statistics and data analysis tools and scripting. Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs). Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems. Strong sense of responsibility and accountability towards assigned role with professional work ethic. Effective communication skills in written and spoken English to articulate technical concepts and findings.

Responsibilities

The role involves defining and developing reliability test flows and plans, managing qualification execution, and driving down defect rates through optimized manufacturing processes. Additionally, it requires collaboration with cross-functional teams to resolve issues and improve product reliability.