Engineer, Packaging Engineering at Sandisk

Batu Kawan, Penang, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

02 Jun, 26

Salary

0.0

Posted On

04 Mar, 26

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Simulation Modeling, Tooling Design, Structural Integrity, Reliability, Mechanical Responses, Solid State Drives, Process Interactions, Solidworks, Semiconductor Packaging Processes, Substrate Design, Die Attach, Flip Chip, Computational Solid Mechanics, Experimental Solid Mechanics, Failure Analysis, Design Of Experiment

Industry

Semiconductor Manufacturing

Description

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Job Description We are seeking a highly skilled and innovative Engineer, Packaging Engineering to join our team in Batu Kawan, Malaysia. In this role, you will be responsible for developing and implementing cutting-edge packaging solutions for our semiconductor products, ensuring optimal performance and reliability. As a Packaging Engineer, you will work in the Packaging R&D group through simulation modeling & tooling design for semiconductor packaging, flash memory product and host levels. ESSENTIAL DUTIES AND RESPONSIBILITIES: Responsible for influencing package and product design by addressing structural integrity and reliability issues and advancing the technology of semiconductor packaging in general. The scope is to address all mechanical aspects of packaging technology and associated material and process interactions. The focus will be on solutions to meet increased demand for small form factor packages with thinner chips, denser interconnects, higher power, and higher reliability drives for product development and also manufacturability. Responsible for the modeling and simulation, design of experiment, tooling design and testing, whichever comes first for best engineering practice, of mechanical responses of IC package and flash products including solid state drives and process interactions. This position will interface with package & product design, electrical and physical characterization, reliability testing, failure analysis, assembly R&D and other process teams. Qualifications REQUIRED: B.S. in Mechanical Engineering or equivalent. Fresh Graduate is encouraged. PREFERRED: Proficiency in Solidworks CAD software or any equivalent software. Good understanding of general semiconductor packaging processes, materials, technology and trends, such as substrate design and manufacturing, molding, wire-bonding, die attach, flip chip, etc. Demonstrated ability to analyze and solve complex engineering issues creatively and efficiently. Excellent organizational and time management skills. Collaborative mindset with the ability to work effectively in cross-functional teams. SKILLS: Solid knowledge through academic coursework or experience required in mechanical engineering of IC packaging and related areas. Strong background in computational solid mechanics and/or experimental solid mechanics with emphasis on failure analysis and design of experiment. Broad knowledge of mechanical behaviors of various material types, including composite laminates, polymers, and metals (e.g., solder). Working knowledge in designing and conducting mechanical testing and/or using a commercial FEA package. Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying. NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email [email protected]. Job Type (exemption status): Exempt position - Please see related compensation & benefits details below Business Function: Packaging Engineering Work Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office

Responsibilities

The engineer will be responsible for developing and implementing cutting-edge packaging solutions for semiconductor products, focusing on structural integrity and reliability. This involves addressing mechanical aspects of packaging technology for small form factor packages with higher demands for density and reliability.