Engineer, packaging engineering at Sandisk

Shanghai, Shanghai, China -

Full Time

Start Date

Immediate

Expiry Date

06 Sep, 26

Salary

0.0

Posted On

08 Jun, 26

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Wire Bonding, Flip Chip Packaging, Semiconductor Packaging, Yield Improvement, IC Fabrication, Analytical Skills, Problem Solving, Interpersonal Communication

Industry

Semiconductor Manufacturing

Description

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Job Description •Defines, develops and qualifies new wire bonded as well as flip chip semiconductor packages with subcontractors and maintains quality of existing packages. · •Manages next generation packaging technologies with internal R&D teams and eternal technology partners •Works closely with the various business units within the company to understand future product needs and suggest packaging solutions. •Drive yield improvement and better efficiency of subcontractors operation •Manages the entire life cycle of packages from path finding all the way to qualification and HVM Qualifications •Master degree in Electrical Engineering, Chemical Engineering, Material Science, Physics, or a related engineering discipline •Excellent communication and interpersonal skills is required •Strong problem-solving and analytical skills would be highly desirable •Knowledge of IC fabrication and packaging is plus. •This is an entry-level position; no prior work experience is needed. Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying. Job Type (exemption status): Exempt position - Please see related compensation & benefits details below Business Function: Packaging Engineering Work Location: Shanghai SNDK Minhang Office--LOC_SNDK_Shanghai SNDK Minhang

Responsibilities

The role involves defining, developing, and qualifying new semiconductor packages while managing next-generation packaging technologies with R&D teams. The engineer will also drive yield improvements and manage the package life cycle from pathfinding to high-volume manufacturing.