Engineer, Product Engineering (Media Health Manufacturing), Heterogenous In at Micron Technology

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

03 Mar, 26

Salary

0.0

Posted On

03 Dec, 25

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Electrical Engineering, Electronics Engineering, Semiconductor Devices, Circuit Design, Product Validation, Problem-Solving, CMOS Technology, DRAM Architecture, Device Physics, Data Analysis, Statistics, Python, JMP, Communication Skills, Project Management, Cross-Functional Collaboration

Industry

Semiconductor Manufacturing

Description

Optimized Test Coverage: The responsibility of ensuring optimized test coverage on all current and future HIG HBM design architectures and process nodes is a technical aspect of this role. This is crucial for maintaining the effectiveness and efficiency in high-volume manufacturing. Ensuring that these products are reliable and meet the necessary standards is a technical task that directly impacts the market readiness of the products. Support for New Product Design Validation: The role provides support for design verification and in-depth circuit of new products using CAD tools and Verilog simulations. This technical support is crucial for the development of new products and technologies. Yield Improvement and Cost Reduction: The role involves technical tasks like improving manufacturing test yields (Specifically related to Device Issues from the DRAM, Interface and Stacked Die Yield), reducing test time, and resolving yield-related issues. These activities are critical for cost reduction and meeting yield targets. Root Cause and Resolution of Manufacturing Test Flow Issue, Qual and RMA Device Issues Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions. Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development. Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products. Performs hardware, software, semiconductor design or telecomm engineering assignments. Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field. Coursework or internship experience in semiconductor devices, circuit design, or product validation is a plus. Solid understanding of problem-solving methodologies, with a focus on identifying root causes and exploring solution spaces. Familiarity with CMOS technology, DRAM architecture, and basic device physics. Exposure to data analysis, statistics, and scripting tools such as Python or JMP. Flexible and eager to learn, with a willingness to take on diverse roles in a dynamic engineering environment. Clear and effective communication skills in written and spoken English, especially when articulating technical concepts and findings

Responsibilities

The role involves ensuring optimized test coverage for HIG HBM design architectures and supporting new product design validation. Additionally, it focuses on yield improvement, cost reduction, and cross-functional collaboration for effective project execution.