Start Date
Immediate
Expiry Date
21 Jun, 26
Salary
0.0
Posted On
23 Mar, 26
Experience
5 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Silicon Assembly, IC Packaging, Manufacturing Engineering, Automation, Controls, Photolithography, Thin Films, Electrochemical Plating, Etch, Compression Molding, Singulation, Die Attach, Ball Grid Array Attach, RF Test, FMEA, SPC
Industry
Aviation and Aerospace Component Manufacturing