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ENGR I, MANUFACTURING EQUIP; MFG at onsemi

Seremban, Negeri Sembilan, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

16 Oct, 26

Salary

0.0

Posted On

18 Jul, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Die Attach, Wire Bond, Sintering, Molding, Singulation, SPC, FMEA, 8D, DOE, Analytical Skills, Communication Skills

Industry

Semiconductor Manufacturing

Description

Responsible for supporting Assembly manufacturing equipment, driving equipment reliability and leading New Product Introduction (NPI) activities for new package and product development. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits [https://www.onsemi.com/careers/career-benefits] We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

Responsibilities

Support assembly manufacturing equipment to drive reliability and lead New Product Introduction activities. Focus on new package and product development within the semiconductor assembly process.