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Engr Prin, Package Development (NPI Mold Engineer) at onsemi

Seremban, Negeri Sembilan, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

04 Aug, 26

Salary

0.0

Posted On

06 May, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Package Development, Molding Process Development, Singulation Process Development, Transfer Molded Power Modules, JMP, Minitab, Auto-CAD, MS Office, Process Characterization, NPI

Industry

Semiconductor Manufacturing

Description

Job Summary: · Discrete and Power module assembly process (End of Line: Mold, Trim/Form, CD/ED) Development. · Key person responsible to align processes between R&D and Manufacturing. · Establish process POR through set up, feasibility and characterization followed by package development procedure. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits [https://www.onsemi.com/careers/career-benefits] We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

Responsibilities

Develop assembly processes for discrete and power modules, focusing on molding, trim/form, and CD/ED. Align processes between R&D and manufacturing to establish process POR through feasibility and characterization.