Start Date
Immediate
Expiry Date
04 Sep, 26
Salary
0.0
Posted On
06 Jun, 26
Experience
5 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Project Management, Semiconductor Manufacturing, Wafer Bump Process, Assembly Test Backend, WLCSP Processes, IATF 16949, Change Control Board, Technical Writing, Cross-functional Leadership, Packaging
Industry
Semiconductor Manufacturing