Start Date
Immediate
Expiry Date
23 Aug, 26
Salary
0.0
Posted On
25 May, 26
Experience
10 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Backend Semiconductor Manufacturing, Assembly Process Expertise, Wafer-Level Packaging, Bumping, NPI, Product Integration, Process Integration, Chip-to-Package Interaction, Project Management, DOE Characterization, SPC, Failure Analysis, Statistical Analysis, Data Analytics, English Communication, Mandarin Communication
Industry
Semiconductor Manufacturing