Failure Analysis Engineer (Fresh Graduate) at Texas Instruments

Hang Tuah Jaya Municipal Council, Malacca, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

19 Aug, 26

Salary

0.0

Posted On

21 May, 26

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Circuit Analysis, Fault Isolation, Physical Analysis, Root Cause Analysis, SEM, EDX, X-ray, Optical Microscopy, 8D Methodology, 5 Whys, FMEA, Deprocessing, Technical Report Writing, Schematic Interpretation, Electrical Verification, Data Analysis

Industry

Semiconductor Manufacturing

Description

Change the world. Love your job. Texas Instruments is seeking a Failure Analysis Engineer to be responsible for technical functions in support of engineering activities such as characterization design, test, checkout, and modifications of assembly technologies. In this role, you will also work with die level failure analysis - circuit analysis as well as verify fail mode of die, isolate failure site and identify fail mechanism. The FA Engineer position provides the opportunity for interacting with wafer fab processing and assembly/test care-about while interfacing with Design Engineering, Product Engineering and CQE. Responsibilities include: * Circuit analysis, bench level equipment skills, die level deprocessing, report writing * Ability to work from schematic diagrams, written and verbal descriptions, layouts or defined plans to perform testing, checkout, and trouble-shooting functions * Perform bench level electrical verification/fault isolation on integrated circuits to determine root cause of failure * Perform Physical analysis, eg: cross sectioning/polishing, optical miscrospy, SEM, EDX, X ray etc * Identify rootcause using structured methodologies (8D, 5 Whys, FMEA etc) * Must become proficient in a variety of failure analysis techniques and equipment operation * Excellent judgment required to isolate failures for accurate identification of defect locations * Correlate failure to assembly process, eg die attach, wire bonding, molding, plating etc * Individual is responsible for managing the failure analysis process in conjunction with their own skill set development * Work in a team environment and provide consultation for non-F/A disciplines * Write detailed failure analysis report Why TI? * Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics. * We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI [https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/pages/4012] * Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. About Texas Instruments Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com [https://www.ti.com/]. Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. If you are interested in this position, please apply to this requisition. TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.

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Responsibilities

The engineer is responsible for performing die-level failure analysis, including circuit analysis and physical analysis to identify failure mechanisms. They will collaborate with wafer fab and assembly teams to correlate failures to manufacturing processes and write detailed technical reports.