Failure Analysis Engineer - X-ray Computed Tomography at Apple

Bengaluru, karnataka, India -

Full Time

Start Date

Immediate

Expiry Date

05 Mar, 26

Salary

0.0

Posted On

05 Dec, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

X-ray Imaging, Computed Tomography, Failure Analysis, Data Analysis, Technical Reporting, Problem Solving, Collaboration, Material Characterisation, Machine Operation, Image Reconstruction, Data Acquisition, 3D Data Interpretation, Communication Skills, Adaptability, Mentoring, Radiation Safety

Industry

Computers and Electronics Manufacturing

Description

The people here at Apple don’t just build products — they build the kind of wonder that’s revolutionised entire industries. It’s the diversity of those people and their ideas that inspires the innovation that runs through everything we do, from amazing technology to industry-leading environmental efforts. Join Apple, and help us leave the world better than we found it. Imagine what you could do here. We're seeking a self-driven, energetic individual to join the Failure Analysis Team in Bangalore. The team is responsible for root cause failure analysis across all Apple Hardware products and advanced material characterisation for guiding design and process changes. DESCRIPTION In this job role, you will be responsible for performing failure analysis utilising X-ray imaging, Computed Tomography (CT) and other non-destructive imaging techniques to assist in the determination of root cause of failures. A significant portion of the role will involve optimisation of X-ray CT scan parameters for a variety of consumer electronic products, sub-assemblies and components to deliver the best data quality and resolution while optimising for throughput. As part of the role, you will drive development of innovative methods / techniques to aid in failure analysis, improve turn around time and ensure equipment utilisation and uptimes. Additionally, you will be responsible in communicating results to cross functional teams, collaborating with them to drive corrective actions and providing technical updates to upper management. MINIMUM QUALIFICATIONS Masters degree in Materials Science, Mechanical Engineering, Physics or related discipline. Strong grasp of X-ray CT principles, including machine operation, image reconstruction, data analysis. 5+ years of hands on experience in operating Industrial CT systems (Micro-focus and Nano-focus sources). Level 1/ 2 AERB certification. Good understanding of material (plastics, metals, and composites) - X-ray interaction to optimise scan parameters for best resolution and throughput. Experience with data acquisition, analysis software and ability to interpret complex 3D data. Creating comprehensive technical reports with crisp and concise data for presenting to cross-functional teams Excellent verbal and written communication and presentation skills. Strong aptitude for problem solving and can-do attitude Ability to communicate complex technical information in a simple, concise manner Adaptability to fast changing environment and scope of work to meet business needs Ability to prioritise and juggle multiple high priority tasks at the same time Willing to collaborate closely across organisations Enjoys working in a fast-paced environment PREFERRED QUALIFICATIONS PhD. in Materials Science, Mechanical Engineering, Physics or related discipline. 10+ years of hands on experience in operating Industrial CT systems (Micro-focus and Nano-focus sources). Failure Analysis exposure preferably in Consumer Electronics. Experience being a Radiation Safety Officer (RSO) with knowledge of AERB regulations and guidelines. Experience in technically mentoring and managing Jr. Engineers and / or technicians.

Responsibilities

You will perform failure analysis using X-ray imaging and Computed Tomography to determine the root cause of failures. Additionally, you will optimize scan parameters and communicate results to cross-functional teams.