SUMMARY

Posted: Aug 07, 2025
Role Number:200615338-0836
Apple is looking for a FEA engineer to lead structural, thermal, and dynamic analysis of touch sensor, flat panel displays and their integration process to join our team! You’ll solve critical challenges across design, process, and materials to accelerate development and uncover root causes with physics-informed ML. Join our team and help in advancing the future of engineering simulation through a digital twin framework that integrates FEA, testing, and AI/ML!

DESCRIPTION

In this role you’ll craft and implement analysis of ground breaking designs, enabling early material, process and structural design optimization as well as root cause and failure analysis of mechanical problems. Generate FEA/analytical models of mechanical parts, modules, and assemblies. Perform static, dynamic, structural, and thermal-mechanical analysis. Implement and optimize these models for large-scale datasets on scalable ML platforms. Own and drive material characterization and testing plan to support modeling efforts. As well as apply methods of modeling and analysis of modules across programs. This is a highly collaborative role that will require coordinated work with analyst to integrate module models into larger system assemblies. You’ll be tasked to communicate and report analysis results to the team as well as cross-functional peers and management. You’ll work with team members to brainstorm and propose solutions to problems based on data analysis. Generate applicable engineering specifications and create applicable processes to assure consistent early analysis and design validation of critical issues. Drive failure analysis, root cause efforts, and design experiments to resolve difficult problems.

MINIMUM QUALIFICATIONS

• B.S. Degree minimum in Mechanical Engineering or Materials Science or related field and 3 years of relevant industry experience
• Experience with advanced FEA analysis in consumer electronic products and/or modules

PREFERRED QUALIFICATIONS

• Ph.D. or M.S. degree in Physics, Material Science, Mechanical Engineering with related field experience preferred
• Experience with LS-DYNA and ANSYS-ICEPAK
• Working knowledge with adhesive material, ACF material, flat panel display material
• Strong Expertise in Machine Learning, Deep Learning, and Optimization
• Strong expertise in GNNs, CNNs, and transformer-based architectures
• Direct experience with flat panel display, touch sensor, lamination process is preferred
• Experience working with Abaqus or ANSYS
• Experience with flex circuits, ACF bonding, flex bending, adhesives, flat panel display, material science and/or basic chemistry
• Experience with structural and thermal focus; non-linear FEA
• Excellent written and verbal communication skills and people skills; ability to interact with management, team members and external vendors

Please refer the Job description for details