KEY JOB ACCOUNTABILITIES:

• To establish new processes & tooling capability based on unit process/equipment/material roadmap, related to advanced packaging, 2.5/3D, heterogenous integration, wafer-level packaging process technologies.
• Establish assembly material selection guide systematic and sustaining in Unit Process Technology roadmapping.
• Perform material and equipment tool benchmarking, understand and converging customers’ product requirements with equipment supplier capabilities.
• Lead new equipment phase-in and commissioning in factory for new R&D and NPI projects.
• Perform process, equipment and tooling capabilities reviews for New Technologies or New Products requirements.Interaction with Business Units and Process Engineering team for new package and process development, aligning with R&D strategy for material selection and equipment/tooling benchmarking systematic.

REQUIRED EXPERIENCE AND QUALIFICATIONS:

• Degree in Engineering (Mechanical/Chemical/Electrical Engineering or science in Chemistry/Physic).
• Minimum of 10 years of experience in semiconductor industry, related to process and equipment engineering.
• Strong knowledge of wafer-level packaging technology, AOI, and chip attachment methods.
• Knowledge in DOE, process control (Lean six sigma or DMAIC) and Statistical Tools, such as JMP.
• Strong cross-functional teamwork, collaboration, interpersonal, written and business skills.
• Good communication skills in dealing with Business Units, suppliers and customers.
• Lead project across organization and culture in a fast-paced environment
• Good analytical and problem-solving skills, and able to work independently with minimal supervision.

Please refer the Job description for details